From Datasheet to Design: Thermal Design for modern DC/DC Converters

Modern DC/DC converters are expected to handle higher ambient temperatures in smaller footprints to optimize cost and solution-size in automotive, personal electronics and industrial equipment. This session will enable engineers to understand the thermal demands of high-power density designs for their next-generation products. We will examine how to read and interpret data sheet thermal metrics such as Θ JA and Ψ JT for TI’s Flipped Die on Lead Frame (HotRod) packages, and how to gather necessary information from efficiency and typical thermal performance curves. We will also highlight how to do effective thermal layouts and showcase studies of the tradeoffs for routing, layer count and thermal vias on thermal performance.

About the Presenter

Dorian Brillet de Candé

Semiconductor Industry Marketing Manager, Texas Instruments

Dorian Brillet de Candé has been with Texas Instruments since 2018 with previous work as an applications engineer for low voltage high current buck converter and controllers.